Overview of TLY-5 Laminates
The foundation of the TLY-5 PCB lies in its advanced laminate composition. Manufactured from lightweight woven fiberglass, TLY-5 offers superior dimensional stability compared to conventional chopped fiber reinforced PTFE composites. This stability is critical for high-volume manufacturing, where consistency and reliability are paramount.
Key Material Characteristics
Dielectric Constant (Dk): With a value of 2.2 and a tight tolerance of ±0.02 at 10 GHz/23°C, the TLY-5 PCB ensures minimal signal loss and exceptional performance in high-frequency environments.
Loss Tangent (Df): At just 0.0009 at 10 GHz, the low dissipation factor contributes to high signal integrity, making it ideal for applications requiring precision.
Moisture Absorption: A moisture absorption rate of only 0.02% minimizes the risk of performance degradation over time, particularly in humid environments.
Benefits of TLY-5 PCB
1. Dimensionally Stable
One of the most significant advantages of the TLY-5 PCB is its dimensional stability. This characteristic ensures that the board maintains its integrity under varying environmental conditions, reducing the risk of warping or deformation during manufacturing or operation.
2. Low Dissipation Factor
The low DF of the TLY-5 PCB enhances signal integrity, making it suitable for high-frequency applications where even minor losses can lead to significant performance issues. This feature is crucial for automotive radar systems and millimeter wave antennas.
3. Low Moisture Absorption
The minimal moisture absorption of the TLY-5 PCB protects against performance degradation. This characteristic is especially beneficial in outdoor applications or environments with fluctuating humidity levels.
4. High Copper Peel Strength
The TLY-5 PCB boasts high copper peel strength, ensuring durability and reliability in demanding applications. This feature is essential for ensuring that the conductive layers remain intact under mechanical stress.
5. Uniform Dielectric Constant
The consistent dielectric constant across the board allows for predictable performance, which is vital for applications requiring precision in signal transmission.
| TLY TYPICAL VALUES |
| Property | Test Method | Unit | Value | Unit | Value |
| DK at 10 GHz | IPC-650 2.5.5.5 | | 2.2 | | 2.2 |
| Df at 10 GHz | IPC-650 2.5.5.5 | | 0.0009 | | 0.0009 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Dielectric Strength | ASTM D 149 | V/mil | 2,693 | V/mil | 106,023 |
| Volume Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms/cm | 1010 | Mohms/cm | 1010 |
| Volume Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms/cm | 1010 | Mohms/cm | 109 |
| Surface Resistivity | IPC-650 2.5.17.1(after elevated temp.) | Mohms | 108 | Mohms | 108 |
| Surface Resistivity | IPC-650 2.5.17.1(after humidity) | Mohms | 108 | Mohms | 108 |
| Flex Strength(MD) | IPC-650 2.4.4 | psi | 14,057 | N/mm2 | 96.91 |
| Flex Strength(CD) | IPC-650 2.4.4 | psi | 12,955 | N/mm2 | 89.32 |
| Peel Stength(½ oz.ed copper) | IPC-650 2.4.8 | Ibs./inch | 11 | N/mm | 1.96 |
| Peel Stength(1 oz.CL1 copper) | IPC-650 2.4.8 | Ibs./inch | 16 | N/mm | 2.86 |
| Peel Stength(1 oz..CV1 copper) | IPC-650 2.4.8 | Ibs./inch | 17 | N/mm | 3.04 |
| Peel Stength | IPC-650 2.4.8(after elevated temp.) | Ibs./inch | 13 | N/mm | 2.32 |
| Young's Modulus(MD) | ASTM D 3039/IPC-650 2.4.19 | psi | 1.4 x 106 | N/mm2 | 9.65 x 103 |
| Poisson's Ratio(MD) | ASTM D 3039/IPC-650 2.4.19 | | 0.21 | | 0.21 |
| Thermal Conductivity | ASTM F 433 | W/M*K | 0.22 | W/M*K | 0.22 |
| Dimensional Stability(MD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.038 | | -0.038 |
| Dimensional Stability(CD,10mil) | IPC-650 2.4.39(avg.after bake&thermal stress) | mils/inch | -0.031 | | -0.031 |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.19 | g/cm3 | 2.19 |
| CTE(X axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 26 | ppm/℃ | 26 |
| CTE(Y axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 15 | ppm/℃ | 15 |
| CTE(Z axis)(25-260℃) | ASTM D 3386(TMA) | ppm/℃ | 217 | ppm/℃ | 217 |
| NASA Outgassing(% TML) | | | 0.01 | | 0.01 |
| NASA Outgassing(% CVCM) | | | 0.01 | | 0.01 |
| NASA Outgassing(% WVR) | | | 0.00 | | 0.00 |
| UL-94 Flammability Rating | UL-94 | | V-0 | | V-0 |
Construction Details
This PCB is constructed as a 2-layer rigid board, specifically designed to meet the needs of high-frequency applications. Here’s a breakdown of its
construction:
Copper Layers: Each copper layer measures 35 μm, providing excellent conductivity.
Core Material: The TLY-5 core is 0.762 mm (30 mil) thick, contributing to the board's mechanical stability.
Minimum Trace and Hole Sizes: The board supports a minimum trace/space of 4/5 mils and a minimum hole size of 0.3 mm, allowing for intricate designs and high-density layouts.
Thickness and Weight: The finished board thickness is 0.8 mm, with a copper weight of 1 oz (1.4 mils) on the outer layers, ensuring adequate conductivity without compromising on size.
Quality Assurance
Before shipment, every TLY-5 PCB undergoes 100% electrical testing to ensure functionality and reliability. This rigorous testing process is crucial for maintaining the highest industry standards.
Applications of TLY-5 PCB
The TLY-5 PCB is versatile and ideal for a wide range of applications, including:
Automotive Radar: Critical for advanced driver-assistance systems (ADAS), the TLY-5 PCB supports high-frequency signals necessary for accurate detection and navigation.
Satellite and Cellular Communications: Its low loss and stable characteristics make it suitable for communication devices operating in challenging environments.
Power Amplifiers: The TLY-5 PCB is designed to handle high power levels, making it an excellent choice for amplifying signals in various applications.
LNBs, LNAs, and LNCs: These components are essential in satellite technology, and the TLY-5 PCB ensures optimal performance in signal reception and processing.
Aerospace Applications: With its lightweight and stable construction, the TLY-5 PCB is a reliable choice for aerospace electronics, where performance and reliability are critical.
Ka, E, and W Band Applications: The TLY-5 PCB is engineered to operate effectively in these high-frequency bands, making it suitable for cutting-edge communication technologies.
Conclusion
The TLY-5 PCB represents a significant advancement in printed circuit board technology. Its unique properties, including low moisture absorption, high copper peel strength, and exceptional dielectric performance, make it the ideal solution for high-frequency applications across various industries. As technology continues to evolve, the TLY-5 PCB stands ready to meet the challenges of tomorrow's electronic demands.
For engineers and manufacturers seeking a reliable, high-performance PCB solution, the TLY-5 is an investment in quality and innovation that will drive success in today's competitive landscape.
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