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Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold, Silver and

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Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold, Silver and

Name: Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold Silver and
Brand: Bicheng
Price: 9.99 USD

Best Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold, Silver and wholesale

Brand Name : Bicheng

Model Number : BIC-189.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : Ceramic-filled, Glass-reinforced Hydrocarbon

Layer count : Double Sided PCB, Multilayer PCB, Hybrid PCB

PCB thickness : 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )

PCB size : ≤400mm X 500mm

Solder mask : Green, Black, Blue, Yellow, Red etc.

Copper weight : 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

Surface finish : Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

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Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold, Silver and Tin

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

RO4535 High Frequency Laminates, ceramic-filled, glass-reinforced hydrocarbon based material, are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. It has a dielectric constant of 3.44 and a loss tangent (Df) of 0.0037 measured at 10 GHz. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Thus, it provides excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing our designers to optimize the price and performance of the antennas. The resin systems of RO4535 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna.

Features and Benefits

1. Low Loss 0.0037 , Low Dk 3.44, low PIM response: Wide range of application use

2. Thermoset resin system: Compatible with standard PCB fabrication

3. Excellent dimensional stability: Greater yield on larger panels sizes

4. Uniform mechanical properties: Maintains mechanical form during handling

5. High thermal conductivity: Improved power handling

Typical Applications:

1. Cellular infrastructure base station antennas

2. WiMAX antenna networks

Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold, Silver and

Our PCB Capability (RO4535)

PCB Material:	Ceramic-filled, Glass-reinforced Hydrocarbon
Designation:	RO4535
Dielectric constant:	3.44
Dissipation Factor	0.0037 10GHz
Layer count:	Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:	20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm )
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc..

RO4535 Typical Values

Property	RO4535	Direction	Units	Condition	Test Method
Dielectric Constant, er Process	3.44 ± 0.08	Z	-	10 GHz/23℃ 2.5 GHz	IPC-TM-650,2.5.5.5
Dissipation Factor	0.0032	Z	-	2.5 GHz/23℃	IPC-TM-650, 2.5.5.5
Dissipation Factor	0.0037	Z	-	10 GHz/23℃	IPC-TM-650, 2.5.5.5
PIM (Typical)	-157	-	dBc	Reflected 43 dBm swept tones	Summitek 1900b PIM Analyzer
Dielectric Strength	>500	Z	V/mil	0.51 mm	IPC-TM-650, 2.5.6.2
Dimensional Stability	<0.5	X,Y	mm/m (mils/inch)	after etch	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion	16	X	ppm/℃	-55 to 288℃	IPC-TM-650, 2.4.41
	17	Y
	50	Z
Thermal Conductivity	0.6	-	W/(m.K)	80℃	ASTM C518
Moisture Absorption	0.09	-	%	D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Tg	>280	-	℃ TMA	A	IPC-TM-650, 2.4.24.3
Density	1.9	-	gm/cm³	-	ASTM D792
Copper Peel Strength	5.1 (0.9)	-	lbs/in (N/mm)	1 oz. EDC post solder float	IPC-TM-650, 2.4.8
Flammability	V-0	-	-	-	UL 94
Lead-Free Process Compatible	Yes	-	-	-	-

Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold, Silver and

Rogers RO4535 High Frequency Printed Circuit Board RO4535 60mil 30mil 20mil Antenna PCB with Immersion Gold, Silver and Images

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