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Rogers Rt/Duroid 6002 High Frequency Pcb 20mil For Microwave

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Rogers Rt/Duroid 6002 High Frequency Pcb 20mil For Microwave

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Brand Name : Bicheng

Model Number : BIC-096.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : RT/Duroid 6002

Layer count : 2 Layer, Multilayer

PCB thickness : 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 120mil (3.048mm)

PCB size : ≤400mm X 500mm

Solder mask : Green, Black, Blue, Yellow, Red etc.

Copper weight : 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

Surface finish : Bare copper, HASL, ENIG, OSP etc..

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Rogers RT/Duroid 6002 High Frequency PCB with 10mil, 20mil, 30mil and 60mil Coating Immersion Gold and Immersion Silver.

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Hello everyone,

Today, we talk about the high frequency PCB made on RT/duroid 6002 material.

The RT/ duroid ® 6002 microwave material is a kind of low loss and low dielectric constant laminate, which can meet the strict requirements for mechanical reliability and electrical stability in complex microwave structural design. The main components are PTFE ceramics composites.

The dielectric constant of RT/duroid ®6002 has excellent resistance to temperature change between -55 ℃ and 150 ℃, which can meet the requirements of filter, oscillator and delay line application design for its electrical stability.

Rogers Rt/Duroid 6002 High Frequency Pcb 20mil For Microwave

The main advantages are:

Firstly, low loss ensures excellent high Frequency performance

Secondly, excellent mechanical and electrical properties, reliable multi-layer board construction.

Thirdly, extremely low thermal coefficient of dielectric constant,ensure excellent dimensional stability.

Fourthly, in-plane expansion coefficient matched to copper, allows for more reliable surface mounted assemblies.

Fifthly, low outgassing, ideal for space applications

Rogers Rt/Duroid 6002 High Frequency Pcb 20mil For Microwave

Typical applications are:

1. Phased Array Antennas

2. Round Based and Airborne Radar Systems

3. Commercial Airline Collision Avoidance

4. GPS antennas

5. Power Backplanes

Our PCB Capability (RT/duroid 6002)

PCB Capability
PCB Material: Ceramic-filled PTFE composite
Designation: RT/duroid 6002
Dielectric constant: 2.94 ±0.04 (process)
2.94 (design)
Layer count: 2 Layer, Multilayer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm)
30mil (0.762mm), 60mil (1.524mm), 120mil (3.048mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..
   

The base copper of RT/druoid PCB has 0.5oz, 1oz and 2oz; the thickness of PCB board is wide, ranging from 5mil to 120mil to be considered by our designers.

The basic colour of RT/duroid 6002 PCB is white.

RT/duroid 6002 PCB is very suited to the equipment of flat and non-planar structures, such as antennas, complex multi-layer circuits with inner-layer connections, and microwave circuits for aerospace designs in hostile environments.

If you have any questions, please feel free to contact us. Thank you for your reading.

Appendix: Data Sheet of RT/duroid 6002

RT/duroid 6002 Typical Value
Property RT/duroid 6002 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.94±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 2.94 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0012 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +12 Z ppm/℃ 10 GHz 0℃-100℃ IPC-TM-650 2.5.5.5
Volume Resistivity 106 Z Mohm.cm A ASTM D 257
Surface Resistivity 107 Z Mohm A ASTM D 257
Tensile Modulus 828(120) X,Y MPa(kpsi) 23℃ ASTM D 638
Ultimate Stress 6.9(1.0) X,Y MPa(kpsi)
Ultimate Strain 7.3 X,Y %
Compressive Modulus 2482(360) Z MPa(kpsi) ASTM D 638
Moisture Absorption 0.02 % D48/50 IPC-TM-650 2.6.2.1
ASTM D 570
Thermal Conductivity 0.6 W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)
16
16
24
X
Y
Z
ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500 ℃ TGA ASTM D 3850
Density 2.1 gm/cm3 ASTM D 792
Specific Heat 0.93(0.22) j/g/k
(BTU/ib/OF)
Calculated
Copper Peel 8.9(1.6) Ibs/in.(N/mm) IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes


Product Tags:

Duroid 6002 High Frequency Pcb

      

20mil High Frequency Pcb

      

Microwave High Frequency Pcb

      
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