4 Layer Flex-rigid PCB Built On 1.6mm FR4 and 0.2mm Polyimide With Immersion Gold and Green Solder Mask For Instrument
(FPC’s are custom-made products, the picture and parameters shown are just for reference)
General description
This is a type of rigid flex PCB for the application of Portable Sound Systems. It’s a 4 layer PCB with flexible part in the middle. The base laminate is from Shengyi, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.
Parameter and data sheet
| Size of Flexible PCB | 60.22 X 132.27mm |
| Number of Layers | 4 |
| Board Type | Rigid-flex PCB |
| Board Thickness | 1.6mm |
| Board Material | FR-4 1.6mm / Polyimide 25µm |
| Board Material Supplier | Shengyi |
| Tg Value of Board Material | 60℃ |
| |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | 35 µm |
| Surface Cu thickness | 35 µm |
| | |
| Coverlay Colour | Yellow Coverlayer / Green solder mask |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | no |
| Stiffener Thickness | N/A |
| | |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 2 |
| |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
| |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Features and benefits
Excellent flexibility
Reducing the volume
Weight reduction
Consistency of assembly
The end can be whole soldered
Low cost
Continuity of processing
Professional and experienced engineers
Engineering design prevents problems from occurring in pre-production.
Applications
Instrument panel, Mobile phone camera flex board, Tablet antenna soft board
Brief Introduction of FPC
Flexible Printed Circuit Board (FPC) is referred to as "soft board". In the industry, FPC is a printed circuit board made of flexible insulating substrate (mainly polyimide or polyester film), which has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, folded. The volume of electronic products can be greatly reduced by using FPC, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communication, laptop, computer peripherals, PDA, digital camera and other fields or products.
FPC also has the advantages of good heat dissipation, solderability, easy mounting and low cost.
Flexible printed circuit board has one layer, two layers and multilayer board. The base material is polyimide clad laminate. This kind of material has high heat resistance and good dimensional stability. It is the final product through pressing with the coating film which has both mechanical protection and good electrical insulation. The surface and inner conductors of double-sided and multi-layer printed circuit boards are metallized to realize the electrical connection of inner and outer layers.
The function of flexible circuit board can be divided into four kinds, namely, lead line, printed circuit, connector and multifunction integrated system, which cover computer, computer peripheral auxiliary system, consumer household electrical appliance and automobile, etc.
