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Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

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Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

Brand Name : Bicheng

Model Number : BIC-455.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : FR-4

Layer count : 2 layers

PCB thickness : 1.6+/-10% MM

PCB size : 65 x 71mm=1UP

Solder mask : Green

Silkscreen : White

Copper weight : 1oz

Surface finish : Electrolytic Gold

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Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

(Printed circuits boards are custom-made products, the picture and parameters shown are just for reference)

1.1 General description

This is a type of double sided circuit board built on FR-4 substrate with Tg 170°C for the application of keypad. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and hard gold on pads. The base material is from Shengyi supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

1.2 Features and benefits

1. Industrial standard material with high Tg (170℃ by DSC) and excellent thermal reliability;

2. Lead free assemblies with a maximum reflow temperature of 260℃;

3. SMT process is resistant to reflow soldering, resistant to rework;

4. Quick and on-time delivery;

5. ISO9001, ISO14001, UL certified manufacturing factory;

6. Competitive price;

7. No quality complaint is meant to save money;

8. Quick CADCAM checking and free PCB quotation.

Keypad PCB Hard Gold Circuit Board Built On Tg170 FR-4 With Green Solder Mask

1.3 PCB Specifications

Item Description Requirement Actual
Basic information Board type Double sided PCB Double sided PCB
Layer count 2 layers 2 layers
Board size 65 x 71mm=1UP 65 x 71mm=1UP
Laminate Laminate Type FR4 TG≧170: CTI:175V-249V FR4 TG≧170: CTI:175V-249V
Supplier / /
Tg TG ≧170℃ TG ≧170℃
Finished thickness 1.6+/-10% mm 1.57 mm
Plating Thickness PTH Cu thickness >20 um 22.13um
Inner layer Cu Thickness 1/1 OZ 1/1 OZ
Surface Cu thickness 35 um 45.1 um
Solder Mask Material type LP-4G G-05 LP-4G G-05
Supplier Nan Ya Nan Ya
Color Green Green
Single / both sides Both Sides Both Sides
S/M thickness >=10.0 um 26.93 um
3M tape test NO Peel Off no peel off
Legend Material type S-380W S-380w
Supplier Tai yo Tai yo
Color White White
Location Both Sides Both Sides
3M tape test No peel off no peel off
Circuit Trace Width (mm) 0.203+/-20%mm 0.195mm
Spacing (mm) 0.203+/- 20%mm 0.199 mm
Electroplated Gold Nickel 100u" 112u"
Gold 10u" 11.11u"
Reliabilty Tests Thermal shock test 288±5℃, 10sec ,3 cycles NO Discolor , NO Delamination
solder abllity test 245±5℃ 100% wetting
Function Electrioal Test 100% pass
Standard IPC-A 600H class 2, IPC_6012C CLASS 2 100% Pass
Appearance Visual inspection 100% Pass
warp and twist <= 0.75% 0.26%
V-Groove V-Cut thickness 0.4±0.1 mm 0.41mm
Angle 30+/- 5 30º
Drill table (mm) T1 PTH 0.508+/-0.075mm
T2 PTH 0.710+/-0.075mm
T3 NPTH 5.000+/-0.05mm

1.4 Applications

DC To DC Converter

USB Wlan Adapter

Rf Transceiver

Controlled Access

Fiber optic receptors

1.5 Our PCB Capability (2022)

Parameter Value
　Layer Counts　 1-32
　Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
　Maximum Size 　Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
　Board Outline Tolerance 　±0.0059" (0.15mm)
　PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm) 　±8%
Thickness Tolerance(t＜0.8mm) 　±10%
　Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
　Minimum Track 0.003" (0.075mm)
　Minimum Space 　0.003" (0.075mm)
　Outer Copper Thickness 　35µm--420µm (1oz-12oz)
　Inner Copper Thickness 　17µm--350µm (0.5oz - 10oz)
　Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
　Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
　Registration (Mechanical) 0.00197" (0.05mm)
　Aspect Ratio 　12:1
　Solder Mask Type 　LPI
　Min Soldermask Bridge 0.00315" (0.08mm)
　Min Soldermask Clearance 0.00197" (0.05mm)
　Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance 　±10%
　Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger


Product Tags:

Double Sided FR4 PCB Board

      

Hard Gold FR4 PCB Board

      

Double Sided Hard Gold PCB

      
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