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Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

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Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

Name: Rogers RO3006 High Frequency Printed Circuit Board 2Layer Rogers 3006 10mil PCB DK615 DF 0002 Microwave Gold PCB
Brand: Bicheng
Price: 9.99 USD

Best Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB wholesale

Brand Name : Bicheng

Model Number : BIC-045.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : RO3006

Layer count : 2 layers

PCB thickness : 0.3mm

PCB size : 152 x 152mm=1PCS

Copper weight : 0.5oz

Surface finish : immersion gold

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Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3006 circuit materials are composite materials made of ceramic-filled PTFE, specifically designed for use in commercial microwave and RF applications. These materials offer excellent electrical and mechanical stability while remaining cost-effective. Their consistent mechanical properties enable the development of multi-layer board designs without encountering issues such as warping or reliability problems. The coefficient of thermal expansion (CTE) of RO3006 materials in the X and Y axis is 17 ppm/℃, which is well-matched to that of copper. This compatibility ensures excellent dimensional stability, with minimal etch shrinkage of less than 0.5 mils per inch after etching and baking. In the Z-axis, the CTE is 24 ppm/℃, providing exceptional reliability for plated through-holes, even in harsh environments.

Here are some typical applications of RO3006 materials:

1) Automotive radar
2) Datalink on cable systems
3) Patch antenna for wireless communications
4) Power amplifiers and antennas
5) Remote meter readers

PCB Specifications

PCB SIZE	152 x 152mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 18um(0.5 oz)+plate TOP layer
	RO3006 0.254mm
	copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	14 mil / 14 mil
Minimum / Maximum Holes:	0.4 mm / 4.0 mm
Number of Different Holes:	1
Number of Drill Holes:	1
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RO3006 0.254mm
Final foil external:	1 oz
Final foil internal:	N/A
Final height of PCB:	0.3 mm ±0.1mm
PLATING AND COATING
Surface Finish	Immersion Gold
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

Data Sheet of Rogers 3006 (RO3006)

RO3006 Typical Value
Property	RO3006	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	6.15±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	6.5	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.002	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-262	Z	ppm/℃	10 GHz -50℃to 150℃	IPC-TM-650 2.5.5.5
Dimensional Stability	0.27 0.15	X Y	mm/m	COND A	IPC-TM-650 2.2.4
Volume Resistivity	105		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	105		MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	1498 1293	X Y	MPa	23℃	ASTM D 638
Moisture Absorption	0.02		%	D48/50	IPC-TM-650 2.6.2.1
Specific Heat	0.86		j/g/k		Calculated
Thermal Conductivity	0.79		W/M/K	50℃	ASTM D 5470
Coefficient of Thermal Expansion (-55 to 288℃)	17 17 24	X Y Z	ppm/℃	23℃/50% RH	IPC-TM-650 2.4.4.1
Td	500		℃ TGA		ASTM D 3850
Density	2.6		gm/cm³	23℃	ASTM D 792
Copper Peel Stength	7.1		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

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Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB Images

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Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

Rogers RO3006 High Frequency Printed Circuit Board 2-Layer Rogers 3006 10mil PCB DK6.15 DF 0.002 Microwave Gold PCB

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